1 产品综述............................................................................................................................................................................................. 2
2 电路介绍............................................................................................................................................................................................. 3
3主要芯片、主要信号流程介绍........................................................................................................................................................... 6
3.1 主芯片(U10):MST6M181VS-LF-Z1-SJ ............................................................................................................................. 6
3.2功放IC(U41):TAS5711....................................................................................................................................................... 8
3.3 SPI FLASH芯片(U42):EN25F32-100HIP ........................................................................................................................ 10
3.4 DDR芯片(U29):W9425G6JH-4 ....................................................................................................................................... 12
3.5 高频调谐器(U22).............................................................................................................................................................. 15
4.0 机芯所使用的DC/DC芯片[ U6、U7(26E61HR) ]:EUP3482DIR1........................................................................................... 16
5.0 机芯所使用的DC/DC芯片U7(24E61HR) :MP8708EN .......................................................................................................... 18
6.0 维修说明........................................................................................................................................................................................ 20
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